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    Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W
    Detailed Product Description

     

    Detailed Product Description
    Max PCB Size: 600*460mm Max Component Height: 11mm
    Laser Source: UV, CO2 Cutting Precision: ±20 μm
    Name: PCB Laser Depaneling Weight: 500Kg

     

    Industrial PCB Laser Depaneling with Different Laser Source 10/12/15/18W

     

    PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

    Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

     

    Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

     

    Damages and fractures to substrates and circuits due to mechanical stress

    Damages to PCB due to accumulated debris

    Constant need for new bits, custom dies, and blades

    Lack of versatility – each new application requires ordering of custom tools, blades, and dies

    Not good for high precision, multi-dimensional or complicated cuts

    Not useful PCB depaneling/singulation smaller boards

    Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

     

    Advantages of Laser PCB depaneling/singulation

     

    • No mechanical stress on substrates or circuits

    • No tooling cost or consumables.

    • Versatility – ability to change applications by simply changing settings

    • Fiducial Recognition – more precise and clean cut

    • Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.

    • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

    • Extraordinary cut quality holding tolerances as small as < 50 microns.

    • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

     

    Specification:

     

    Parameter

     

     

     

     

     

     

     

     

    Technical parameters

    Main body of laser

    1480mm*1360mm*1412 mm

    Weight of the

    1500Kg

    Power

    AC220 V

    Laser

    355 nm

    Laser

     

    Optowave 10W(US)

    Material

    ≤1.2 mm

    Precisio

    ±20 μm

    Platfor

    ±2 μm

    Platform

    ±2 μm

    Working area

    600*450 mm

    Maximum

    3 KW

    Vibrating

    CTI(US)

    Power

    AC220 V

    Diameter

    20±5 μm

    Ambient

    20±2 ℃

    Ambient

    <60 %

    The Machine

    Marble

     



    Product Categories
                                  Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W
                                  Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W
                                  Industrial PCB UV / CO2 Laser Depaneling Machine 10/12/15/18W
                                   
                                  Detailed Product Description

                                   

                                  Detailed Product Description
                                  Max PCB Size: 600*460mm Max Component Height: 11mm
                                  Laser Source: UV, CO2 Cutting Precision: ±20 μm
                                  Name: PCB Laser Depaneling Weight: 500Kg

                                   

                                  Industrial PCB Laser Depaneling with Different Laser Source 10/12/15/18W

                                   

                                  PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

                                  Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

                                   

                                  Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

                                   

                                  Damages and fractures to substrates and circuits due to mechanical stress

                                  Damages to PCB due to accumulated debris

                                  Constant need for new bits, custom dies, and blades

                                  Lack of versatility – each new application requires ordering of custom tools, blades, and dies

                                  Not good for high precision, multi-dimensional or complicated cuts

                                  Not useful PCB depaneling/singulation smaller boards

                                  Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

                                   

                                  Advantages of Laser PCB depaneling/singulation

                                   

                                  • No mechanical stress on substrates or circuits

                                  • No tooling cost or consumables.

                                  • Versatility – ability to change applications by simply changing settings

                                  • Fiducial Recognition – more precise and clean cut

                                  • Optical Recognition before PCB depaneling/singulation process begins. CMS Laser is one of the few companies to provide this feature.

                                  • Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

                                  • Extraordinary cut quality holding tolerances as small as < 50 microns.

                                  • No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

                                   

                                  Specification:

                                   

                                  Parameter

                                   

                                   

                                   

                                   

                                   

                                   

                                   

                                   

                                  Technical parameters

                                  Main body of laser

                                  1480mm*1360mm*1412 mm

                                  Weight of the

                                  1500Kg

                                  Power

                                  AC220 V

                                  Laser

                                  355 nm

                                  Laser

                                   

                                  Optowave 10W(US)

                                  Material

                                  ≤1.2 mm

                                  Precisio

                                  ±20 μm

                                  Platfor

                                  ±2 μm

                                  Platform

                                  ±2 μm

                                  Working area

                                  600*450 mm

                                  Maximum

                                  3 KW

                                  Vibrating

                                  CTI(US)

                                  Power

                                  AC220 V

                                  Diameter

                                  20±5 μm

                                  Ambient

                                  20±2 ℃

                                  Ambient

                                  <60 %

                                  The Machine

                                  Marble

                                   



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                                  YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016
                                  CONTACT US
                                  Website:https://www.pcbcuttingmachine.com
                                  Contacts:Eva Liu +86 13416743702
                                  Tel:+86-512-62751429
                                  Skype:evaliuhuan
                                  Email:sales@yushunli.com evaliu@hk-yush.com
                                  Address: Building H, GuoRui Pioneering Park,
                                  No. 1068 Jinyang East Road, Lujia Town, Kunshan,Suzhou.
                                  Postcode:215331
                                  Dongguan Factory Address: 5th Floor, No.10,
                                  Shanquan Road, Yongtou Village, Chang’an Town,
                                  Dongguan City, Guangdong province, China.
                                  Postcode:523843
                                  YUSH Electronic Technology Co.,Ltd. Pomeas Optical Technology Copyright 2016